| 摘要 |
<p>A stack package is provided to improve electrical and physical contact reliability between semiconductor chips by forming a reinforcing member of a pump shape. A stacked package(100) is made by stacking more than two semiconductor chip(110) in which a penetration via(130) is formed by more than one reinforcing member(170). At least more than two semiconductor chips a penetration silicon via protruded to the bottom of the semiconductor chip. The semiconductor chips are stacked physically and electrically through the penetration silicon via. At least more than one reinforcing member is on between the stacked semiconductor chips and reinforces the bonding between the semiconductors.</p> |
