| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to narrow spaces between bumps by forming bump layers which include conductive particles and photo sensitive materials on the bonding pads of a semiconductor chip. CONSTITUTION: A plurality of bonding pads are arranged on a semiconductor chip(10). Connection pads which correspond to the bonding pads are arranged on a substrate(20). The bonding pads and the connection pads are coated with a bump layer which includes conductive particles and photo sensitive materials. The bump layer is patterned by the photo sensitive materials in order to form bumps(30) which includes conductive particles. The bonding pads and the connection pads are electrically connected by the conductive particles in the bumps. |
