POWER DEVICE PACKAGE AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A power device package and a fabricating method of the same are provided to increase thermal conductivity while making the device thin by forming a metal plate with thinner than an insulating layer. CONSTITUTION: A cavity for a power device mounting is formed in a metal plate(110). The metal plate is functioned as a heat-sinking member releasing heat from the power device(130). A circuit layer(120) comprises an internal circuit layer(120a) formed in the inner wall of cavity and external circuit layer(120b). The external circuit layer is formed to be extended on the surface of the metal plate. The resin-seal(140) protects the power device from the external environment.