| 摘要 |
<p>PURPOSE: A semiconductor package method and a method for manufacturing the same are provided to transmit heat which is generated in a semiconductor chip to outside by arranging a base plate with superior thermal conductivity on the lower side of the semiconductor chip. CONSTITUTION: A semiconductor chip(600) includes a bonding pad(640). A chip receiving body(700) forms a receiving space for the semiconductor chip. The chip receiving body includes a sidewall(710) and a base plate(720) connected to the sidewall. One end of a rerouting(800) is electrically connected to the bonding pad. The other end of the rerouting is expanded to the upper side of the sidewall. A solder resist pattern(830) includes an opening which exposes a part of the rerouting.</p> |
