| 摘要 |
PURPOSE: An oven apparatus for manufacturing of a semiconductor is provided to prevent bubble in an adhesive due to high temperature by inserting a lead frame in a heating chamber. CONSTITUTION: A lower plate(3) is fixed to a base plate. An upper plate forms a heating chamber with the lower plate. . A heating element(5) is installed in the lower plate to heat the lead frame or the substrate in the heating chamber. A pump connection pipe(14) is connected to a vacuum pump and intakes air inside the heating chamber to make the heating chamber vacuum. A packing is installed between the bottom of the lower plate and the flange of the pump connection pipe and prevents air leakage from the heating chamber. |
