发明名称 VAPOR COOLING APPARATUS FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To simplify the structure in order to make easy the manufacture and improve reliability by integrating a tank and a condenser. CONSTITUTION:An aluminum clad plate partly provided with a hole and a ring- shaped material 5 cut away from a pipe are alternately laminated and these are integrated by brazing within a furnace. The rings 5 form a tank which accommodates semiconductor element and a plate portion becomes a hear radiator 6. A cover 7 provided with terminal for supply of power is attached to a tank and a closed cooling apparatus can be formed. A chamber connected to the tank is provided at both ends of unit using the rings 9 which are larger than said both ends of unit. Moreover, a plurality of hollow pipes 8 which pass through the heat radiating plate 6 and both chambers at both ends are integrated by brazing. When semiconductor element is housed within a tank and the coolant is supplied to the tank and electrical power is supplied through the terminal, the coolant is vaporized and it rises to the upper part of a single chamber from the tank, flows into the hollow pipe 8. It is then liquified by the cooling window and returns into the tank from the other chamber. Heat is transmitted to the heat radiating plate from hollow pipe and is irradiated to the outside therefrom.
申请公布号 JPS6147655(A) 申请公布日期 1986.03.08
申请号 JP19840169417 申请日期 1984.08.15
申请人 TOSHIBA CORP 发明人 KIJIMA KENJI
分类号 H05K7/20;H01L23/427;H01L23/44 主分类号 H05K7/20
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