发明名称 |
LIGHT-EMITTING CHIP, LED PACKAGE, BACKLIGHT FOR LIQUID CRYSTAL DISPLAY, LIQUID CRYSTAL DISPLAY, AND ILLUMINATION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip coating type LED package capable of improving light efficiency. <P>SOLUTION: The chip coating type LED package includes a light-emitting chip including a chip die attached to a sub-mount, and a resin layer that uniformly covers its outer surface; at least one bump ball provided at the chip die so as to be exposed to the outside through the top surface of the resin layer; an electrode electrically coupled via a metal wire; and a package body comprising the electrode and to which the light-emitting chip is mounted. According to the invention, it is possible to prevent a difference in color temperature depending on an illumination angle to improve light efficiency and to increase yields of processes. Furthermore, it is possible to further reduce the size of the package, and mass production can be achieved. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011029665(A) |
申请公布日期 |
2011.02.10 |
申请号 |
JP20100240608 |
申请日期 |
2010.10.27 |
申请人 |
SAMSUNG LED CO LTD |
发明人 |
LEE SEON GOO;HAN KYUNG TAEG;HAN SEONG YEON |
分类号 |
H01L33/44;H01L33/50;H01L33/58;H01L33/62 |
主分类号 |
H01L33/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|