| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressing device applicable to a sheet sticking device which sticks an adhesive sheet on an inner surface side of an adherend having a shape which is opened at least on one end side. SOLUTION: The pressing device 16 is configured to stick the adhesive sheet S to a recessed part 12 of a semiconductor wafer W which is provided with an annular projection part 11 on an outer peripheral side and has the recessed part 12 inside, and an elastic member 23 comprising a bottom lid part 23A and a cylindrical part 23B is arranged at an opening part 20 of an upper lid member 21 to form a pressurized chamber C. An elastic ring 24 is mounted on an outer peripheral side of the cylindrical part 23B. While the bottom lid part 23A presses the adhesive sheet S against a bottom surface of the recessed part 12 by pressurizing the pressurized chamber C, the cylindrical part 23B and elastic ring 24 press the adhesive sheet S against a side face of the recessed part 12. COPYRIGHT: (C)2011,JPO&INPIT |
