| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To configure a mount frame, having an adhesive tape joined over a surface of a wafer where a circuit pattern is formed and a ring frame, such that the adhesive tape is rejoined to a wafer back surface side and an adhesive tape on the front surface side is peeled before conveyance to a dicing step. <P>SOLUTION: A wafer holding table 44 that suction-holds the wafer of the mount frame MF moves downward below a frame holding table 44 when a joining roller 26 passes over an exposed portion of the adhesive tape T between the ring frame (f) and wafer W. Here, the exposed portion of the adhesive tape T inclines obliquely downward, thereby joining the adhesive tape DT to the mount frame MF. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
