发明名称 PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To inhibit the occurrence of disconnection or cracks in a lead-out wiring led out from a land located on the outermost periphery of an electronic-component mounting area. <P>SOLUTION: A printed wiring board 1 includes: a plurality of lands 2 arranged in a mounting area 1a in which an electronic component is mounted; and each lead-out wiring 5 respectively connected to a specific land (for example, a corner land 7) which is at least one of the outermost-peripheral lands 6 arranged on the outermost periphery. A joint 11 between the specific land and the lead-out wiring 5 connected to the specific land is located inside a closed curve (an outermost-peripheral line 10 of the lands) which collectively surrounds all of the outermost-peripheral lands 6, formed in the mounting area 1a, by the shortest path. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011029287(A) 申请公布日期 2011.02.10
申请号 JP20090171638 申请日期 2009.07.22
申请人 RENESAS ELECTRONICS CORP 发明人 SHIBUYA KOJIRO
分类号 H01L23/12 主分类号 H01L23/12
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