| 摘要 |
PROBLEM TO BE SOLVED: To overcome the problem caused when laminating a plurality of semiconductor chips on a wafer, wherein processing time for positioning is extremely lengthened, thereby damaging productivity. SOLUTION: A method of manufacturing a multilayer semiconductor device includes an acquisition step of respectively acquiring observed coordinate values for a plurality of indices prepared on a semiconductor substrate in which a plurality of circuit regions are formed, a calculation step (S102) for calculating an error parameter such that a difference between converted coordinate values obtained by converting designed coordinate values for the plurality of indices held in advance by a coordinate conversion formula specified by a predetermined error parameter, and the observed coordinates for the plurality of indices acquired by the acquisition step, is minimized, and an arrangement step (S103) for determining the arrangement positions of a plurality of semiconductor chips fragmented corresponding to circuit regions respectively by the designed coordinate values and the coordinate conversion formula and arranging them in each of the plurality of circuit regions on the semiconductor substrate. COPYRIGHT: (C)2011,JPO&INPIT |
