EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR ELEMENT SEALED BY USING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which has excellent fluidity when melted and excellent warp resistance of a package. SOLUTION: The epoxy resin composition for sealing the semiconductor contains an epoxy resin of 2-15 mass% of the total mass of the epoxy resin composition and a flexibilizer of 0.8-4.5 mass% of the total mass thereof. The epoxy resin contains a bisphenol A type epoxy resin which is shown by formula (1) and is of 30-100 mass% of the total mass of the epoxy resin. The flexibilizer contains amino-modified silicone which is shown by formula (2) and is of 50-100 mass% of the total mass of the flexibilizer. The epoxy resin composition for sealing the semiconductor has the excellent fluidity when melted and the excellent warp resistance of the package. COPYRIGHT: (C)2011,JPO&INPIT