ULTRASONIC JOINING DEVICE

摘要

PURPOSE:To execute stable joining at a high speed with a joining tool under ultrasonic oscillation by oscillating an ultrasonic oscillator by constant current driving and impressing the oscillation to the joining tool. CONSTITUTION:After a ball is formed to the top end of a fine wire W extended to the top end of the bonding tool 19, an oscillating arm 12 is rotationally driven by a driving device 11 to press-weld the ball to an electrode pad of a semiconductor pellet P by the bonding tool 19 provided to the top end of a bonding arm 14. The ultrasonic oscillator 26 attached to the rear end of the arm 14 is driven by the constant current from an ultrasonic output circuit 25 for the wire bonding period to oscillate ultrasonically the oscillator 26. The oscillation is amplified by the arm 14 and is transmitted to the tool 19. The ball formed to the top end of the wire W is then joined to the electrode pad by the press welding of the tool 19 and the ultrasonic oscillation transmitted through the tool 19.