发明名称 METHOD FOR HEATING FOOD PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for heating a food package by which a food package such as contents in a container or packaged contents can be uniformly heated (sterilized) in a pressurizing atmosphere while making heating electrodes follow the shape of the food package. <P>SOLUTION: The method for heating a food package comprises: placing a package 1 charged with food P in a pressurization chamber 21 while gripped by two split-type pin-supporting electrodes 38', 38' molded into the outer shape of the body of the package 1 via an insulation member 46; and subjecting the food P to dielectric heating while pressurizing the inside of the pressurization chamber 21 with saturated or superheated steam and applying a high-frequency electric field to the split-type pin-supporting electrodes 38', 38' by a high-frequency power supply 47. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011024424(A) 申请公布日期 2011.02.10
申请号 JP20090170159 申请日期 2009.07.21
申请人 TOYO SEIKAN KAISHA LTD 发明人 YAMADA SHINJI;TATSUMI SHIGETAKA
分类号 A23L3/01;H05B6/54 主分类号 A23L3/01
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