| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a miniaturized semiconductor device reducing intervals of mounting components arranged on a mounting board by preventing an underfill resin from being spread on application. <P>SOLUTION: In a manufacturing process of this semiconductor device, an underfill resin for protecting a joint part between an electrode of a first semiconductor chip and an electrode of a mounting board is filled in a space between the first semiconductor chip constituting a flip-chip mounting body and a printed wiring board (the mounting board). Then, the underfill resin is filled while suppressing the flow of the underfill resin on the side opposite to the side where the underfill resin enters into the space. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
