| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a leadframe which method prevents the formation of a plating burr, and the leadframe manufactured by the manufacturing method, and to provide a method of manufacturing a semiconductor device using the leadframe. SOLUTION: An upper-side terminal 13 is projected on the upper surface of the leadframe material 11. A first resist film 27 and a second resist film 28 are formed as masks on the upper surface and the lower surface of the leadframe material 11, respectively. A first metal plating layer 31 and a second metal plating layer 32 are formed on the upper surface of the upper-side terminal 13 and in an area for forming a lower-side terminal 19 on the under surface of the leadframe material 11, using the first resist film 27 and the second resist film 28, respectively, to form the leadframe 10. COPYRIGHT: (C)2011,JPO&INPIT
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