发明名称 PHOTORESIST COMPOSITION
摘要 The present invention provides a photoresist composition comprising a resin which comprises a structural unit derived from a compound having an acid-labile group and a structural unit derived from a compound represented by the formula (a): wherein R1 represents a hydrogen atom, a halogen atom, a C1-C6 alkyl group or a C1-C6 halogenated alkyl group, k represents an integer of 1 to 6, W1 represents a C6-C18 divalent aromatic hydrocarbon group which can have one or more substituents selected from the group consisting of a halogen atom, a hydroxyl group, a C1-C12 alkyl group, a C1-C12 alkoxy group, a C6-C14 aryl group, a C7-C15 aralkyl group, a glycidyloxy group and a C2-C4 acyl group, and R2 represents a hydrogen atom, a group represented by the formula (R2-1) or a group represented by the formula (R2-2), wherein R3, R4 and R5 independently each represent a C1-C12 hydrocarbon group, and R3 and R4 can be bonded each other to form a ring, R6 and R7 independently each represent a hydrogen atom or a C1-C12 hydrocarbon group, and R8 represents a C1-C12 hydrocarbon group, and which is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid.
申请公布号 US2011033804(A1) 申请公布日期 2011.02.10
申请号 US20100852072 申请日期 2010.08.06
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 SHIMADA MASAHIKO;ICHIKAWA KOJI
分类号 G03F7/004;C08G63/00;G03F7/20 主分类号 G03F7/004
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