发明名称 Liquid film assisted laser die marking and structures formed thereby
摘要 Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a liquid on a region of a die, and then forming an identification mark through the liquid on the die.
申请公布号 US2011031590(A1) 申请公布日期 2011.02.10
申请号 US20090462441 申请日期 2009.08.04
申请人 VAKANAS GEORGE P;VORONOV SERGEI L;NG LUEY CHON;MALOUF GEORGE E 发明人 VAKANAS GEORGE P.;VORONOV SERGEI L.;NG LUEY CHON;MALOUF GEORGE E.
分类号 H01L23/544;H01L21/263 主分类号 H01L23/544
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