A casing for an electronic device is produced from a heat-resistant, flame-retardant thermoplastic by an injection-molding process. This thermoplastic is a polyimide-based plastic with halogen-free flame retardancy.
申请公布号
DE502004012066(D1)
申请公布日期
2011.02.10
申请号
DE20045012066T
申请日期
2004.07.09
申请人
BASF SE
发明人
HESSE, GUENTER;NEUHAUS, RALF;REINFRANK, KARL-MICHAEL;KROISS, ROBERT;SCHOBEL, GUNTER;GUTTING, WOLFGANG;USKE, KLAUS;SZENDRO, MARK
