| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology by which a user of a semiconductor device evades the problem of malfunction and radiation noise of equipment and prevents the increase of cost due to significantly excessive power supply, and besides, a vendor of the semiconductor device can support a user of the semiconductor device to design a printed board in a state where secret information is concealed. <P>SOLUTION: Impedance information on a semiconductor package 1 is added to the semiconductor device used while mounted on the printed board. When power supply-ground pins of the semiconductor package are grouped and it is assumed that power supply and ground potentials in the divided pin groups 3-1 to 3-3 are equal to one another, driving point impedance upper-limit values of the printed board at pin positions of the pin groups 3-1 to 3-3 are determined by frequencies. The impedance information includes information on the determined driving point impedance upper-limit values of the printed board. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
