发明名称 APPARATUS FOR MANUFACTURING ELECTRONIC PARTS
摘要 An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.
申请公布号 US2011030200(A1) 申请公布日期 2011.02.10
申请号 US20100841736 申请日期 2010.07.22
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM SEONG-KU
分类号 B23P19/00 主分类号 B23P19/00
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