| 摘要 |
PROBLEM TO BE SOLVED: To measure stress in a mold in imprint lithography. SOLUTION: In the imprint method, the mold having an uneven pattern in a shape corresponding to a pattern transferred onto a substrate to be processed with first light (S3) and first image information of the mold is obtained (S4). Stress is applied to the mold and a position of the uneven pattern of the mold is adjusted (S5). The mold whose position is adjusted is irradiated with first light and second image information is obtained (S6). Stress information of the mold whose position is adjusted is measured by comparing first image information with second image information (S7). Position adjustment is repeated until a measured result satisfies a desired condition (S8), and the pattern is formed on the substrate to be processed by using the mold whose position is adjusted. COPYRIGHT: (C)2011,JPO&INPIT |
