发明名称 SURFACE PROCESSING SIMULATION DEVICE, CONTROLLER FOR SURFACE PROCESSING APPARATUS AND SURFACE PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To calculate optimal conditions of a raw material fluid for surface processing in vertical rotary surface processing that uses pumpability. SOLUTION: A surface processing simulation device 20 for a vertical rotary surface processing apparatus 10 stores a model calculation program 36 that calculates velocity distribution of the raw material fluid 18 by applying a pumpability model to a storage portion 38. A CPU 30 includes: a parameter acquisition processing portion 42 for inputting and acquiring surface processing parameters; a model calculation portion 44 that calculates the velocity distribution of the raw material fluid 18 to a substrate 16 by applying the acquired surface processing parameters to the model calculation program 36; an optimal flow rate calculation processing portion 46 that calculates the optimal flow rate of the raw material fluid based on the calculated data of the velocity distribution and device parameters; and a flow rate correction processing portion 48 that corrects the optimal flow rate based on the device shape parameters. The productivity flow rate where the optimal flow rate is reduced is determined from the productivity viewpoint. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011029592(A) 申请公布日期 2011.02.10
申请号 JP20100071307 申请日期 2010.03.26
申请人 TOYOTA CENTRAL R&D LABS INC;TOYOTA MOTOR CORP 发明人 JIANG YU YAN;INAGAKI MASAHIDE;NAKAJIMA KENJI;MAKINO SOICHIRO;ITO TAKAHIRO
分类号 H01L21/205;C23C16/52;H01L21/00;H01L21/3065 主分类号 H01L21/205
代理机构 代理人
主权项
地址