发明名称 THERMOELECTRIC MODULES AND RELATED METHODS
摘要 An example thermoelectric module of the present disclosure generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layer of the first laminate is at least partially removed to form electrically conductive pads on the first laminate. The electrically conductive layer of the second laminate is at least partially removed to form electrically conductive pads on the second laminate. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together.
申请公布号 US2011030754(A1) 申请公布日期 2011.02.10
申请号 US20090560194 申请日期 2009.09.15
申请人 LAIRD TECHNOLOGIES, INC. 发明人 SMYTHE ROBERT MICHAEL;HERSHBERGER JEFFREY GERARD;HILL RICHARD F.
分类号 H01L35/02;H01L35/34 主分类号 H01L35/02
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