发明名称 |
METHODE DER VORBEREITUNG EINES MONTAGETRÄGERS FÜR EIN HALBLEITERBAUELEMENT |
摘要 |
The present invention provides a submount that allows a semiconductor light-emitting element to be attached with a high bonding strength. <??>A submount 3 is equipped with a substrate 3 and a solder layer 8 formed on a primary surface 4f of the substrate 4. The density of the solder layer 8 is at least 50% and no more than 99.9% of the theoretical density of the material used in the solder layer 8. The solder layer 8 contains at least one of the following list: gold-tin alloy; silver-tin alloy; and lead-tin alloy. The solder layer 8 before it is melted is formed on the substrate 4 and includes an Ag film 8b and an Sn film 8a formed on the Ag film 8b. The submount 3 further includes an Au film 6 formed between the substrate 4 and the solder layer 8. <IMAGE> |
申请公布号 |
DE60335556(D1) |
申请公布日期 |
2011.02.10 |
申请号 |
DE2003635556 |
申请日期 |
2003.07.30 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES LTD. |
发明人 |
ISHII, TAKASHI;HIGAKI, KENJIRO;TSUZUKI, YASUSHI |
分类号 |
H01L21/52;H01L21/60;H01S5/02;H01S5/022 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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