| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting mount device in which an inter-metal junction part is formed by applying low-frequency vibration to a contact surface where a land-like connecting terminal electrically contacts a spring-like contact. <P>SOLUTION: In the mounting mount device 1 for joining an electronic component 6 including the land-like connecting terminal 5 to a mounting substrate 4 including an interconnector 3 having the spring-like contact 2, the land-like connecting terminals 5 includes: an vibration excitor base 9 in which an Sn-Ag plating 7 is applied on surface contacting the spring-like contact 2, at least a pair of the land-like connecting terminal 5 and spring-like contact 2 is provided and a low-frequency vibration actuator 8 is set; and a rubber plate 14 provided on the lower surface of the vibration excitor base 9. An inter-metal joining part 10 is formed on the contact surface by superimposing the land-like connecting terminal 5 on face the spring-like contact 2 so as to face and electrically driving the low-frequency vibration actuator 8 to vibrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
