WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which incorporates a capacitor and reduces inductance between a semiconductor element and the capacitor when the semiconductor element is mounted and to provide a semiconductor device where the semiconductor element is mounted on the wiring board.

SOLUTION: The wiring board includes a core substrate 13 having an insulating base material 11 comprising an inorganic dielectric and a plurality of linear conductors 12 penetrating from one face of the insulating base member to the other face, ground wiring groups 21b and 23b arranged on both faces of the core substrate and power supply wiring groups 21c and 23c installed on both faces of the core substrate. The ground wiring group and the power supply wiring group are installed via the insulating base material.

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