ENCAPSULATED OPTOELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME

摘要

An encapsulated optoelectronic device includes: a first banner layer; an electro!?minescence device configured to be coupled to the first barrier layer, and comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an optoelectronically active layer disposed between the first and second electrodes; a second barrier layer configured to be coupled to the electroluminescence device; and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers; a first conductive area disposed on the first harrier layer, located between the first and second barrier layers, and configured to be electrically coupled to the first electrode and electrically insulated from the second electrode and a second conductive area, the second conductive area disposed on the first barrier layer, located between the first and second barrier layers, and configured to be electrically coupled to the second electrode and electrically insulated from the first electrode and the first conductive area. A method for making the encapsulated optoelectronic device is also presented.