SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to satisfy the electrical characteristics of a connection electrode the mechanical property of a joint by using low-flow under fill or wafer level under fill method. CONSTITUTION: An under fill resin(100) is coated between the pump electrode(310) of a semiconductor chip and the electrode pad of a substrate. The bump electrode is formed into a solder ball or a solder bump. A filler(110) is coated with a ferroelectric material added to the under fill resin. The filler is arranged in a region having no contact of the pump electrode and the electrode pad. If a current is applied to a current jig(400), attraction and repulsive force due to electromagnetic field are applied to the filler.