METHOD FOR FORMING GROUNDING TAKE-OUT PART IN ELECTROMAGNETIC WAVE SHIELDING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a grounding take-out part capable of separating and removing a transparent covering layer to be exposed for grounding and formed on a conductive layer without separating and cutting the conductive layer.

SOLUTION: The method for forming a grounding take-out part in an electromagnetic wave shielding material includes (A) a release sheet laminating step of temporarily laminating the release sheet 4 on the conductive layer to be a grounding take-out part 6 of a conductive laminating body 3 on a conductive layer where the conductive layer 2 is laminated on a transparent substrate 1, (B) a transparent covering layer laminating step of laminating a transparent covering layer 5 on the conductive layer including the release sheet part, and (C) a transparent covering layer removing step of separating and removing the release sheet and the transparent covering layer on the release sheet and exposing the conductive layer to form the grounding take-out part in this order. Furthermore, (B1) a half-cut forming step of forming a half-cut into the depth from the surface of the transparent covering layer on the edge of the release sheet to the surface of the release sheet may be provided between the step (B) and the step (C).

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