A heat dissipation device includes a heat sink, an axial fan and a fan cover. The heat sink includes a plurality of fins defining a plurality of longitudinal airflow channels therebetween. The axial fan is mounted on a top side of the heat sink. The axial fan defines an air inlet located adjacent to and communicating with the airflow channels of the heat sink. The fan cover is between the heat sink and the axial fan. The fan cover includes a side plate surrounding a top end of the heat sink to make the axial fan just draw cooling air into the heat sink from a position around a bottom end of the heat sink. The cooling air flows upwardly through the heat sink to the air inlet of the axial fan to thereby take heat away from the heat sink.
申请公布号
US2011030930(A1)
申请公布日期
2011.02.10
申请号
US20090581880
申请日期
2009.10.20
申请人
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD.