发明名称 SPUTTERING TARGET APPARATUS
摘要 A sputtering target apparatus is provided. The sputtering target apparatus includes a first target assembly including a first target array having a first target, a second target disposed adjacent to the first target, and a first target dividing region disposed between the first and second targets, the first target assembly extending along a first direction, wherein the first target dividing region has a longitudinal cross-section that is oblique with respect to the first direction.
申请公布号 US2011031117(A1) 申请公布日期 2011.02.10
申请号 US20100779459 申请日期 2010.05.13
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 KIM DO-HYUN;LEE DONG-HOON;JEONG CHANG-OH
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
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