AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME

摘要

An aqueous dispersion for chemical mechanical polishing which comprises both (A) silica particles and (B) a compound having two or more carboxyl groups, characterized in that, in the particle size distribution obtained by subjecting the aqueous dispersion to particle size determination by a dynamic light scattering method, the particle diameter (Db) at which the silica particles (A) exhibit the highest detection frequency (Fb) satisfies the relationship: 35nm < Db = 90nm, and the Fa/Fb ratio is 0.5 or less, Fa being the detection frequency of silica particles that have particle diameters (Da) satisfying the relationship: 90nm < Da = 100nm).