METAL CIRCUIT WIRING HAVING ORGANIC RESIN FOR ADHESIVE LAYERS AND METHOD OF MANUFACTURING IT

摘要

PURPOSE: A metal circuit wiring with an organic adhesive layer and a method for manufacturing the same are provided to form a metal circuit wiring by introducing an organic adhesive layer with the affinity with respect to metal and the superior heat-resistance and chemical-resistance. CONSTITUTION: An organic adhesive layer is formed on a substrate based on a resin selected from a group including an acrylic resin, a chloroprene rubber-based resin, and a silicon rubber-based resin. A metal wiring pattern is formed based on an ink composition containing metal nano particles. The substrate is selected from a group including polyimide, polyester, an epoxy substrate, bismaleimide-triazine, polypropylene, and polyvinyl chloride.