| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-processing tape capable of allowing an operator or an automatic label attaching machine to accurately and making it simply recognize the attaching position of an identifying label. SOLUTION: The wafer processing tape 10 includes a long release film 11, an adhesive layer 12 and an adhesive film 13. The adhesive layer 12 is formed on the release film 11, and includes a circular section 12a, having a substantially circular shape corresponding to a semiconductor wafer shape and a shape with a size equal to or larger than that of the semiconductor wafer; and an indicator section 12b, having a substantially rectangular shape wherein the indicator section is an attaching position indicator provided at an attaching position of an identifying label (such as, a bar code label and a QR code label) placed outside the circular section 12a. COPYRIGHT: (C)2011,JPO&INPIT |
