发明名称 METHOD OF MANUFACTURING PHOTOCOUPLER, METHOD OF MOLDING INSULATING MEMBER, AND METHOD OF MANUFACTURING INSULATING ELECTRONIC MODULE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a reflective photocoupler having superior dielectric strength at low cost. <P>SOLUTION: An LED 3 for converting an input electric signal into an optical signal is electrically connected to a leadframe 1. Further, a light receiving element 4 for converting the optical signal into the electric signal to output it is electrically connected to a leadframe 2. The leadframe 1 and the leadframe 2 are disposed apart from each other. Next, a translucent part 6 containing the LED 3 and the light receiving element 4 is formed. Consecutively, laser beams are irradiated on a surface of the translucent part 6 to form an irregular shape on the surface of the translucent part 6. Finally, a package 7 containing the translucent part 6 is formed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011029467(A) 申请公布日期 2011.02.10
申请号 JP20090174932 申请日期 2009.07.28
申请人 RENESAS ELECTRONICS CORP 发明人 MIURA TOSHIAKI
分类号 H01L31/12 主分类号 H01L31/12
代理机构 代理人
主权项
地址