发明名称 METHOD FOR CLOSING HOLE
摘要 Provide is a method for closing a hole in an object with a film. The method comprises: attaching the object to an electric discharge machine as a workpiece; making an electrode approach the object so as to be overlapped with the hole, the electrode being formed of a powder including a conductive material; repeatedly applying a voltage by using the electric discharge machine between the electrode and the object so that discharging occurs therebetween and thereby growing a film for closing the hole from the periphery of the hole; and performing a mechanical process for sloping the edge of the hole before a step for applying the voltage or sloping the film along the edge of the hole during the step for applying the voltage.
申请公布号 WO2011016516(A1) 申请公布日期 2011.02.10
申请号 WO2010JP63280 申请日期 2010.08.05
申请人 IHI CORPORATION;FURUKAWA, TAKASHI;SHIMODA, YUKIHIRO;WATANABE, MITSUTOSHI;OCHIAI, HIROYUKI 发明人 FURUKAWA, TAKASHI;SHIMODA, YUKIHIRO;WATANABE, MITSUTOSHI;OCHIAI, HIROYUKI
分类号 C23C26/00 主分类号 C23C26/00
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