| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for grinding and a protective tape, causing no crack even if a rear surface of a hard and brittle substrate is ground to be made thin. SOLUTION: A grinding method for grinding a rear surface of a wafer to form the wafer having a predetermined thickness includes the steps of: sticking one surface of a protective tape on a surface of the wafer; sucking and holding another surface of the protective tape to a holding surface of a chuck table of a grinding device; and applying a grinding surface of a grinding wheel on the rear surface of the wafer sucked and held to the holding surface of the chuck table to grind the rear surface of the wafer. A holding part 612 including the holding surface of the chuck table 61 is formed of porous ceramics having a plurality of pores. The another surface of the protective tape 11 is formed to be a roughened surface having a plurality of irregularities fitting into the plurality of pores of the porous ceramics forming the holding part 612 of the chuck table. In the wafer holding step, the plurality of irregularities are fitted to the plurality of pores of the porous ceramics forming the holding part of the chuck table. COPYRIGHT: (C)2011,JPO&INPIT |
