| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging method to stack a plurality of dies, that implements a processor device in a single package together. <P>SOLUTION: A processor logic to perform one or more instructions is allocated among two or more face-to-faces stacked dice 102, 104. The processor includes a conductive interface 275 between the stacked dices to allow die-to-die communication. Efficiencies in processor performance (as measured, for instance, by the number of instructions per clock cycle) and heat and power management are achieved by splitting the logic of a processor core between two stacked dice that work together to cooperatively perform instructions. <P>COPYRIGHT: (C)2011,JPO&INPIT |
