| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with built-in component, which makes a terminal electrode with a built-in chip component not damaged when a hole for a via conductor is formed by laser radiation. <P>SOLUTION: A component built-in resin layer in which chip components are built-in is composed of a side surface layer lower than the upper surface of the chip component and an upper surface layer higher than the upper surface of the chip component, contents of an inorganic material per same volume are set to different values between the upper surface layer and the side surface layer, and the content of the upper surface layer is set to a lower value than the content of the side surface layer. The via conductor is formed mainly in the upper surface layer. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
