发明名称 PIPING THICKNESS REDUCTION INSPECTION APPARATUS AND PIPING THICKNESS REDUCTION INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a piping thickness reduction inspection apparatus and a piping thickness reduction inspection method for identifying a thickness reduction section generated on an external surface of piping, and evaluating an aspect and the magnitude of a thickness reduction in a noncontact inspection using ultrasonic waves. SOLUTION: An ultrasonic array sensor 11 transmits and receives the ultrasonic waves to/from the piping 12. An ultrasonic flaw detector 21 transmits and receives the ultrasonic waves to/from the ultrasonic array sensor 11 by a phased array system. A screen displaying/defect determining apparatus 23 displays a received wave obtained by the ultrasonic flaw detector as an image and estimates a shape of the thickness reduction from the direction of the received significant signal in the displayed image. A calibration curve database 24 stores a thickness reduction depth evaluation diagram created based on an echo strength and a signal generation location based on the shape of the thickness reduction. The screen displaying/defect determining apparatus 23 identifies the generated thickness reduction from a Rayleigh wave echo component and finds the thickness reduction depth from a relational expression among an appearance location of a transverse reflection wave echo in the thickness reduction section, a previously-found reflection strength, and a distance. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011027571(A) 申请公布日期 2011.02.10
申请号 JP20090174136 申请日期 2009.07.27
申请人 BABCOCK HITACHI KK 发明人 MIKI MASAHIRO;NAGASHIMA YOSHIAKI;ENDO MASAO;YAMAMOTO ATSUSHI
分类号 G01N29/04;G01N29/24 主分类号 G01N29/04
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