POWER MODULE

摘要

Disclosed is a product in practical use, wherein damages generated due to cracks and breakage of an insulating substrate while the power module is being molded are eliminated, even if the area of a heat plate configuring a power module pre-product is reduced to be smaller than the area of the insulating substrate, and a demand for miniaturizing the power module as a product is sufficiently met. In the case of configuring the power module by sealing the power module pre-product (Y) using a molding resin layer (7), in a state wherein each of the externally exposed end portions (5b, 6b) on one side of each of the external connecting terminals (5, 6), and the surface on the reverse side of the heat plate (2) are exposed to the outside, a power module substrate (3), which configures a multilayer substrate body (X), is provided with an aligning hole (8), into which an aligning pin (14) is inserted, said aligning pin being provided on a lower molding die (12) which configures a molding die with an upper molding die (11) that forms a molding resin layer (7), and the power module pre-product (Y) is aligned in a cavity (13).