发明名称 SLURRY COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a slurry composition achieving excellent dispersibility without adding a dispersant and giving high strength of a film material obtained from the composition, and to provide a ceramic paste, a conductive paste, a magnetic powder paste, a glass paste, a paste for a heat-developable photosensitive material and a phosphor paste obtained by using the slurry composition. <P>SOLUTION: The slurry composition contains an inorganic powder and a polyvinyl acetal resin, wherein the polyvinyl acetal resin contains a modified polyvinyl acetal resin having structural units expressed by at least a vinyl alcohol unit, a vinyl acetal unit, a vinyl acetate unit and a unit having 1,2-diol expressed by formula (5), and the modified polyvinyl acetal resin contains the structural unit expressed by the formula by 0.05 to 2.0 mol%. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011026371(A) 申请公布日期 2011.02.10
申请号 JP20090170323 申请日期 2009.07.21
申请人 SEKISUI CHEM CO LTD 发明人 OTSUKI KENICHI;HIROSE YUKI
分类号 C08L29/14;B41M5/337;C04B35/632;C08F216/38;C08K3/00;C09K11/02;H01B1/22;H01G4/12 主分类号 C08L29/14
代理机构 代理人
主权项
地址