| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treating apparatus and a tray for the plasma treating apparatus capable of increasing preliminary heating efficiency of a working substrate placed on a stage for improving production efficiency. <P>SOLUTION: A tray storage groove 10 is formed on a placement surface 5a of a stage 5 to allow only a tray 6 for holding for positioning and holding a plurality of semiconductor substrates W to sink. Then, in a process where the tray 6 for holding sinks into the tray storage groove 10, the placement surface 5a of the stage 5 abuts on each semiconductor substrate W supported by a supporting stay 8 through a lattice space and respective semiconductor substrates W are separated from the tray 6 for holding. Respective semiconductor substrates W are placed on the placement surface 5a of the stage 5. <P>COPYRIGHT: (C)2011,JPO&INPIT |
