发明名称 FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film deposition apparatus suppressing deposits to be adhered to a surface of a member exposed to the atmosphere in a treatment container. SOLUTION: The film deposition apparatus deposits a thin film on a surface of an object W to be treated by using organic metal gas within a treatment container 4 which can be evacuated, wherein a hydrophobic layer is provided on the surface of the member exposed to the atmosphere in the treatment container. Thus, deposits to be adhered to the surface of the member exposed to the atmosphere in the treatment container are suppressed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011026634(A) 申请公布日期 2011.02.10
申请号 JP20090170837 申请日期 2009.07.22
申请人 TOKYO ELECTRON LTD 发明人 MATSUMOTO KENJI;MIYOSHI HIDENORI
分类号 C23C16/44;H01L21/205;H01L21/28;H01L21/285;H01L21/31;H01L21/316 主分类号 C23C16/44
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