| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method that takes measures against the following problems: when a via hole is formed in a semiconductor substrate using a CO2YAG laser, resin residues are produced at a via hole bottom part; and then film formation by sputtering is incomplete owing to unevenness of the via hole formed by laser processing, so that metal is diffused in a resin. SOLUTION: An excimer lasers is used to perform processing in which no resin residues are left at the bottom part of the via hole 7. Further, the unevenness is formed in the via hole even by the processing using the excimer laser, and a sputter layer is not uniform, so seed plating 11 on the via hole is carried out. The processing time is greatly shortened as compared with processing including only a sputter step, and a uniform seed layer is formed; and complete via filling is not carried out, but conductive layer plating 10 on the seed layer is carried out, and barrier plating 12 on a surface is performed to prevent a copper plating layer from oxidizing, thereby making an inter-layer connection free of diffusion of copper in the resin. COPYRIGHT: (C)2011,JPO&INPIT
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