| 摘要 |
PURPOSE:To package electronic parts in a three-dimensional pattern with respect to a packaging plane and to improve the packaging density of the electronic parts, by the constitution wherein pins are protruded downward from each package main body, pinholes are provided at the upper ends of the pins, and a plurality of the packages are laminated in the up and down directions. CONSTITUTION:A package 10 has a disk shaped package main body 1 having a sleeve at the peripheral part. A required wiring pattern 3 is formed on the upper surface of the package main body 1 with a conductor film. Leads 5 of a semiconductor device 4, which is mounted on the surface of the package main body 1, are connected to the wiring pattern 3. Meanwhile a plurality of pins 6 are arranged at the sleeve 2 on the periphery of the package main body 1 so that the pins are protruded downward. When a plurality of the packages 10 formed in this way are laminated in the up and down direction, electronic parts such as the semiconductor device 4, which are mounted on the packages 10, are electrically connected one another through the wiring pattern 3, the pins 6 and pinholes 7. Thus the specified circuit is constituted.
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