| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing a short circuit and coming-off of a lead in mounting in the semiconductor device. <P>SOLUTION: This semiconductor device includes: a tab 5 supporting a semiconductor chip 8; a sealing part 12 formed by sealing the semiconductor chip 8 with a resin; tab suspending leads 4 for supporting the tab 5; a plurality of leads 2 including connection object parts exposed in the periphery part of the back surface of the sealing part 12, and thin parts formed more thinly than the connection object parts at an end on the tab side, and each provided with an inner trench 2e and an outer trench 2f on a wire joint surface 2d arranged in the sealing part 12 of the connection object part; and wires 10 for connecting pads 7 of the semiconductor chip 8 to the leads 2. The thin part of lead 2 is covered by a sealing resin, the wire 10 is joined to the connection object part between the outer trench 2f and the inner trench 2e, and the coming-off of the lead is prevented by the thin part, the outer trench 2f and the inner trench 2e of the lead 2. <P>COPYRIGHT: (C)2011,JPO&INPIT |
