SUBSTRATE POLISHING APPARATUS AND METHOD FOR PROCESSING THEREOF

摘要

PURPOSE: A substrate polishing apparatus with a thickness measuring unit and a method for processing the same are provided to reduce omit an additional chamber for measuring the thickness of a substrate by installing the thickness measuring unit in a buffer part. CONSTITUTION: An index(104) includes an index robot(120) transferring a substrate. A substrate polishing part(150) processes a substrate polishing process and a substrate cleaning process. A buffer part(130) receives the substrate transferred by the index robot. A thickness measuring unit(132) is installed in the buffer part and measures the thickness of the substrate. A loading/unloading unit(110) includes a plurality of loading ports(112a to 112d).