发明名称 |
PT-PLATING METHOD FOR POLYIMIDE ELECTRODE |
摘要 |
PURPOSE: A platinum plating method for a polyimide electrode is provided to produce a polyimide electrode capable of accurately measuring bio-signals of micro current by reducing the impedance. CONSTITUTION: A platinum plating method for a polyimide electrode is as follows. A conductive seed layer is washed in sulfuric acid solution before electroplating(S3). The gases in contact with the conductive seed layer surface are eliminated through ultrasonic wave while carrying out electroplating with an electric current density of 2.0 Ma/cm^2 for 2 minutes(S4).
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申请公布号 |
KR20110013993(A) |
申请公布日期 |
2011.02.10 |
申请号 |
KR20090071722 |
申请日期 |
2009.08.04 |
申请人 |
KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
发明人 |
LEE, SANG HOON;BAEK, DONG HYUN;LEE, EUN JOONG;MOON, JIN HEE |
分类号 |
C25D3/50;C25D5/56;H05K3/10 |
主分类号 |
C25D3/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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